JPH0727648Y2 - プリント配線基板 - Google Patents
プリント配線基板Info
- Publication number
- JPH0727648Y2 JPH0727648Y2 JP1987040859U JP4085987U JPH0727648Y2 JP H0727648 Y2 JPH0727648 Y2 JP H0727648Y2 JP 1987040859 U JP1987040859 U JP 1987040859U JP 4085987 U JP4085987 U JP 4085987U JP H0727648 Y2 JPH0727648 Y2 JP H0727648Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- hole land
- land portion
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 claims description 39
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987040859U JPH0727648Y2 (ja) | 1987-03-23 | 1987-03-23 | プリント配線基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987040859U JPH0727648Y2 (ja) | 1987-03-23 | 1987-03-23 | プリント配線基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63149565U JPS63149565U (en]) | 1988-10-03 |
JPH0727648Y2 true JPH0727648Y2 (ja) | 1995-06-21 |
Family
ID=30855322
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987040859U Expired - Lifetime JPH0727648Y2 (ja) | 1987-03-23 | 1987-03-23 | プリント配線基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0727648Y2 (en]) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014027222A (ja) * | 2012-07-30 | 2014-02-06 | Kyocera Corp | 接続構造、およびこの接続構造を備えるサーマルプリンタ |
JP2019041019A (ja) * | 2017-08-25 | 2019-03-14 | 株式会社フジクラ | プリント配線板およびその製造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58122375U (ja) * | 1982-12-23 | 1983-08-20 | 株式会社ニコン | 接続回路基板 |
JPS60101775U (ja) * | 1983-12-14 | 1985-07-11 | 日本ビクター株式会社 | プリント基板の接続構造 |
JPS61192476U (en]) * | 1985-05-22 | 1986-11-29 |
-
1987
- 1987-03-23 JP JP1987040859U patent/JPH0727648Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS63149565U (en]) | 1988-10-03 |
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